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september 2011 doc id 16923 rev 2 1/11 11 ESDAXLC6-1MY2 extra low capacitance single line tvs features extra low capacitance 0.35 pf max on a wide frequency spectrum (200 mhz - 3000 mhz) unidirectional device low clamping factor v cl /v br fast response time very thin package: 0.55 mm max low leakage current high esd protection level high integration suitable for high density boards complies with the following standards iec 61000-4-2 level 4 mil std 883g-method 3015-7: class 3b applications where transient over voltage protection and electrical overstress protection in sensitive equipment is required, such as: computers printers communication systems cellular phone handsets and accessories video equipment portable equipment description the ESDAXLC6-1MY2 is a single line transil? diode designed specifically for the protection of integrated circuits in portable equipment and miniaturized electronics devices subject to esd transient over voltages. packaged in qfn-2l, it minimizes pcb consumption. figure 1. functional diagram tm : transil is a trademark of stmicroelectronics qfn-2l i/01 i/02 gnd www.st.com
characteristics ESDAXLC6-1MY2 2/11 doc id 16923 rev 2 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage: iec 61000-4-2, level 4 : contact discharge 8 kv p pp peak pulse power dissipation (8/20 s) (1) t j initial = t amb 12 w i pp peak pulse current typical value (8/20 s) 2.8 a t j maximum junction temperature 125 c t op operating junction temperature range - 30 to + 85 c t stg storage temperature range - 55 to +150 c 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit i v i rm i r v rm v br symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = breakdown current br rm rm rm r table 2. electrical characteristics (values, t amb = 25 c) symbol test condition min. typ. max. unit v br i r = 1 ma 6 - - v i rm v rm = 3 v --100na c line v r = 0 v, f = (200 mhz - 3000 mhz), v osc = 30 mv - - 0.35 pf
ESDAXLC6-1MY2 characteristics doc id 16923 rev 2 3/11 figure 3. junction capacitance versus reverse voltage applied (typical values) figure 4. junction capacitance versus frequency (v r = 0 v, typical values) 100 150 200 250 300 350 400 450 500 012345 capacitance (ff) voltage (v) f = 200 mhz vosc = 30 mv c (ff) 100 150 200 250 300 350 400 450 500 1 10 100 1000 10000 frequency (mhz) v=0v v=30mv r osc figure 5. s21 (db) attenuation figure 6. relative variation of leakage current versus junction temperature (typical values) 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g 10.0g 14.00 12.00 -10.00 -8.00 -6.00 - - - - - - - 4.00 - 2.00 0.00 s21 (db) f (hz) 1 10 100 1000 10000 25 50 75 100 125 i [t ]/i [t = 25 c] rjr j t (c) j v= 3v t = 25 c r jinitial figure 7. esd response to iec 61000-4-2 (+ 8 kv contact discharge) figure 8. esd response to iec 61000-4-2 (-8 kv contact discharge) 20 v/div 20 ns/div c2 20 v/div 20 ns/div c2
ordering information scheme ESDAXLC6-1MY2 4/11 doc id 16923 rev 2 2 ordering information scheme figure 9. ordering information scheme esdax lc 6 - 1my2 esda array low capacitance package 6 = 6 min breakdown voltage vimum 1 = 1 line my = qfn-2l, max. height: 0.55 mm 2 = 2 pads
ESDAXLC6-1MY2 package information doc id 16923 rev 2 5/11 3 package information epoxy meets ul 94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 3. qfn-2l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.55 0.017 0.020 0.022 a1 0.00 0.05 0.000 0.002 b1 0.20 0.25 0.30 0.008 0.010 0.012 b2 0.20 0.25 0.30 0.008 0.010 0.012 d 1.00 0.039 e 0.60 0.024 e 0.65 0.026 l1 0.45 0.50 0.55 0.018 0.020 0.022 l2 0.45 0.50 0.55 0.018 0.020 0.022 figure 10. footprint (dimensions in mm) figure 11. marking index area (d/2 x e/2) index area (d/2 x e/2) optional pin # 1 id d e a1 a b1 e b2 l2 l1 0.55 0.40 0.50 0.55 pin1 pin 2 7
package information ESDAXLC6-1MY2 6/11 doc id 16923 rev 2 figure 12. qfn-2l tape and reel specification user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 + 0.3 /-0.1 2.0 0.1 1.75 0.1 3.5 - 0.05 ? 1.50 +0.1/-0.0 0.70 0.05 0.20 0.05 1.15 0.05 7 7 7 7 7 7 7 0.59 0.04 cathode bar
ESDAXLC6-1MY2 recommendation on pcb assembly doc id 16923 rev 2 7/11 4 recommendation on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 13. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for central exposed pad: opening to footprint ratio is 50%. c) stencil opening for leads: opening to footprint ratio is 90%. figure 14. recommended stencil window position l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = lead footprint on pcb stencil window position lead footprint on pcb package footprint 0.45 mm 0.39 mm 0.05 mm 0.05 mm stencil window position
recommendation on pcb assembly ESDAXLC6-1MY2 8/11 doc id 16923 rev 2 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20-45 m. 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
ESDAXLC6-1MY2 recommendation on pcb assembly doc id 16923 rev 2 9/11 4.5 reflow profile figure 15. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max
ordering information ESDAXLC6-1MY2 10/11 doc id 16923 rev 2 5 ordering information 6 revision history table 4. ordering information order code marking package weight base qty delivery mode ESDAXLC6-1MY2 7 qfn-2l 0.942 mg 12000 tape and reel table 5. document revision history date revision changes 18-jan-2010 1 initial release. 23-sep-2011 2 updated package name.
ESDAXLC6-1MY2 doc id 16923 rev 2 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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